2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
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Intel® C621
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Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
8 x 3.5" hot-swap SAS/SATA drive bay with SGPIO,2 x 3.5" fixed drive bay
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3 x 8cm (7000 RPM) hot-swap PWM cooling fan(s)
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600/650/740/800/1200W Redundant Power Supply
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With modular architecture design, 2U or 4U scalable configuration
Processor/Cache
Processor
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Chipset
Chipset
Intel® C621
System Memory
Memory Capacity
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
2 Network Activity LEDs, HDD activity LED,Power Status LED,Power Fail LED,System Information LED
Buttons
Power On/Off button,System Reset button
Drive bays
HDD bays
8 x 3.5" hot-swap SAS/SATA drive bay with SGPIO, 2 x 3.5" fixed drive bay
Peripheral Bays
Optional 1 x slim DVD-ROM drive bay, Optional 2 x USB 2.0 ports,Optional 1 x COM port tray,Optional 2 x USB 3.0 ports
Power Supply
Power Supply
600/650/740/800/1200W Redundant Power Supply
Cooling System
Cooling System
3 x 8cm (7000 RPM) hot-swap PWM cooling fan(s)
Form Factor
Form Factor
upto 4U Rackmount
Specifications subject to change without notice. Picture used for representation purpose only and the actual product may differ in looks All other brands and names are the property of their respective owners
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